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Laser-Glasschneiden

Laser in the Semiconductor Industry

Extreme Demands on Speed and Precision

In the semiconductor production the material processing with lasers is standard. This ranges from marking of wafers and marking and separating of completed components to defect analysis. Besides silicon, metallic materials (lead frames and housings) and plastics, especially epoxy resins of grouting materials are processed.

Today, for the majority of the applications diode pumped semiconductor lasers are used in the basic wavelength of 1064 nm and in versions with doubled and tripled frequencies. The partially extreme demands on highly specialized processes in the semiconductor production are responsible for the fact that fiber lasers with comparable long pulse lengths and low pulse peak performances had only little success until today.

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